- All sections
- B - Performing operations; transporting
- B23K - Soldering or unsoldering; welding; cladding or plating by soldering or welding; cutting by applying heat locally, e.g. flame cutting; working by laser beam
- B23K 26/53 - Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
Patent holdings for IPC class B23K 26/53
Total number of patents in this class: 1018
10-year publication summary
|
27
|
66
|
108
|
124
|
142
|
171
|
146
|
131
|
102
|
25
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Hamamatsu Photonics K.K. | 4161 |
178 |
| Disco Corporation | 1745 |
127 |
| Corning Incorporated | 9932 |
103 |
| Tokyo Electron Limited | 11599 |
47 |
| Siltectra GmbH | 88 |
42 |
| TRUMPF Laser- und Systemtechnik GmbH | 505 |
40 |
| SCHOTT AG | 1675 |
36 |
| Lintec Corporation | 1915 |
28 |
| Agc, Inc. | 4029 |
17 |
| Nichia Corporation | 3394 |
13 |
| Nippon Electric Glass Co., Ltd. | 2299 |
12 |
| Hoya Corporation | 2822 |
10 |
| Nippon Sheet Glass Company, Limited | 992 |
10 |
| Samsung Electronics Co., Ltd. | 131630 |
9 |
| LPKF Laser & Electronics AG | 112 |
9 |
| Tokyo Seimitsu Co., Ltd. | 257 |
9 |
| National University Corporation Tokai National Higher Education and Research System | 543 |
8 |
| The Furukawa Electric Co., Ltd. | 3486 |
7 |
| UAB "altechna R&d" | 12 |
7 |
| Rohm Co., Ltd. | 5843 |
6 |
| Other owners | 300 |